Effective suction at low connected load thanks to optimized detection and removal of chips
Your new processing center is aligned and configured to meet your specific requirements
Heavy-duty machine frame and stable sliding gantry design
Bumper safety technology with dynamic pendulum field
Efficient drilling and grooving using high-speed drill heads with quick release and spindle clamp with up to 35 spindles and groove saw
Reduced power consumption thanks to standby mode for all power components at the push of a button or automatically after a defined time interval
| CENTATEQ E-300 | /33 | /42 | /60 |
| Workpiece length X – individual processing (all Units) [mm] | 3,300 | 4,200 | 6,000 |
| Workpiece length X – alternating processing* (all Units) [mm] | 1,020 | 1,470 | 2,370 |
| Workpiece width Y – with tool diameter 25 mm (rear stop) [mm] | 1,550 | 1,550 | 1,550 |
| Workpiece width Y – all units in main spindle (rear stop) [mm] | 1,400 | 1,400 | 1,400 |
| Workpiece width Y – all units in main spindle (front stop) [mm] | 1,050 | 1,050 | 1,050 |
| Workpiece width Y – gluing [mm] | 1,500 | 1,500 | 1,500 |
| Workpiece thickness Z – from console [mm] | 270 | 270 | 270 |