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Effective suction at low connected load thanks to optimized detection and removal of chips

Your new processing center is aligned and configured to meet your specific requirements

Heavy-duty machine frame and stable sliding gantry design

Bumper safety technology with dynamic pendulum field

Efficient drilling and grooving using high-speed drill heads with quick release and spindle clamp with up to 35 spindles and groove saw

Reduced power consumption thanks to standby mode for all power components at the push of a button or automatically after a defined time interval


CENTATEQ E-300 /33 /42 /60
Workpiece length X – individual processing (all Units) [mm] 3,300 4,200 6,000
Workpiece length X – alternating processing* (all Units) [mm] 1,020 1,470 2,370
Workpiece width Y – with tool diameter 25 mm (rear stop) [mm] 1,550 1,550 1,550
Workpiece width Y – all units in main spindle (rear stop) [mm] 1,400 1,400 1,400
Workpiece width Y – all units in main spindle (front stop) [mm] 1,050 1,050 1,050
Workpiece width Y – gluing [mm] 1,500 1,500 1,500
Workpiece thickness Z – from console [mm] 270 270 270